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Alphane Moon@lemmy.worldM to Hardware@lemmy.worldEnglish · 4 days ago

LG Innotek to slim down smartphones by replacing solder balls with copper posts

www.tomshardware.com

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LG Innotek to slim down smartphones by replacing solder balls with copper posts

www.tomshardware.com

Alphane Moon@lemmy.worldM to Hardware@lemmy.worldEnglish · 4 days ago
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LG Innotek introduced Copper Post packaging technology, which replaces traditional solder balls in semiconductor substrates, enabling slimmer, denser, and cooler smartphone designs.
  • SwizzleStick@lemmy.zip
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    4 days ago

    Let’s see how well they drop test…

    • a_person@lemdro.id
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      4 days ago

      Or bend test lol (iphone 15)

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